Packaging Failure Analysis Engineer - Quantum
 Microsoft | |
 United States, Washington, Redmond | |
 Oct 16, 2025 | |
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OverviewMicrosoft's Quantum research group is exploring ways to build a full-stack quantum computer and has become the world's center of expertise on topological quantum computing. The research effort includes theoretical and experimental teams around the world, who have been designing and optimizing all aspects of the quantum computer, from topological qubit designs to cryogenic control and readout circuitry, to runtime software and quantum language compilers. At Microsoft Quantum, we aim to empower science and scientists to solve the world's biggest problems by realizing advanced computing platforms at the intersection of high-performance computing, artificial intelligence, and quantum information technology. Microsoft Quantum will change the world of computing and help solve some of humankind's currently unsolvable problems. For more information about our team, visit https://www.microsoft.com/en-us/quantum.We are looking for a Packaging Failure Analysis Engineer with a focus on hands-on failure and materials analysis and process development. Responsibilities will include driving failure analysis of a variety of devices associated with the quantum hardware program. It will require the development and adaptation of measurement and characterization processes, the use of numerical modelling, and the processing of generated data to support the overall failure analysis mission. You will be working with a diverse team of engineers and scientists on assembling and scaling complex quantum hardware devices. To be successful, you will actively work with our globally distributed team to establish common, robust assembly processes and materials. Microsoft's mission is to empower every person and every organization on the planet to achieve more. As employees we come together with a growth mindset, innovate to empower others, and collaborate to realize our shared goals. Each day we build on our values of respect, integrity, and accountability to create a culture of inclusion where everyone can thrive at work and beyond.
ResponsibilitiesSpecifically, your work will include: Drive analysis of failures in quantum device packaging and associated devices. Report results in a timely and concise manner. Perform materials testing and analysis, particularly for cryogenic applications. Develop assembly and measurement processes and reduce to well documented procedures. Transfer these into production for the global packaging team. Develop mechanical/thermal modelling to support failure analysis and process/materials development activities. Support introduction of new equipment/processes into the packaging laboratories. Work in teams or independently as required. Other:Embody our Culture and Values | |