Packaging Technical Leader

Cisco is seeking a seasoned Packaging Technical Leader to join the Semi & Optics Packaging team within our world-class Supply Chain Organization. As a Technical Leader you will drive innovation in advanced packaging technology and quality for Cisco's cutting-edge ASIC and silicon photonic products.

You will operate at the intersection of advanced technology and strategic execution, working within a highly collaborative and multi-functional environment. This includes close partnerships with design engineering, operations, and supply chain teams to innovate next-generation technologies. You will also engage directly with counterparts at OSATs, Fabs, contract manufacturers and other key suppliers leading technical discussions and problem-solving efforts as well as influencing commodity strategy at a global scale.

This role offers significant technical scope, cross-organizational visibility, and the potential to shape critical technology development and influence long-term product platforms. Key responsibilities:

• Serve as a technical leader in advanced packaging technology (2.5D/3D, TSV, MCM, flip-chip, heterogenous integration). Oversee various aspects such as package assembly, process development, reliability qualification, materials and testing.
• Work with top-tier package assembly partners to develop and qualify packaging solutions for Cisco products.
• Multi-functional technical leadership to proactively identify and mitigate risks, and resolve highly complex packaging issues. Drive/support quality initiatives such as failure analysis (FA), root cause finding, and implementation of corrective actions.
• Work collaboratively with design teams to influence package architecture and provide expert guidance on Design for Manufacturability/Reliability (DfM, DfR) contributing to the definition of critical parameters for HVM.
• Contribute to evaluation of new packaging methods, materials and processes for Cisco product design and implementation.

Minimum Qualifications :

• 6+ years of progressive industry experience in Semiconductor Packaging or Photonic packaging or Assembly process development or integration, with demonstrable track record of technical leadership and successful project execution.
• Knowledge of advanced packaging processes (bumping, flip-chip, TSV, 2.5D/3D, MCM) and materials
• Experience with package design & architecture. Familiar with advanced substrate manufacturing processes and materials and their impact on signal and power integrity.
• Experience in advanced problem-solving methodologies (e.g. 8D, FMEA, statistical process control) and data analysis skills
• Knowledge and experience in physical failure analysis methods.

Preferred Qualifications

• Familiarity or experience with co-packaged optics is a plus
• Experience with volume manufacturing
• Experience with advanced simulation tools for package design and reliability analysis
• Ability to work within and lead projects with highly multi-functional and geographically distributed technical teams.
• Willingness to learn and evolve professionally

At Cisco, we're revolutionizing how data and infrastructure connect and protect organizations in the AI era - and beyond. We've been innovating fearlessly for 40 years to create solutions that power how humans and technology work together across the physical and digital worlds. These solutions provide customers with unparalleled security, visibility, and insights across the entire digital footprint. Simply put - we power the future.

Fueled by the depth and breadth of our technology, we experiment and create meaningful solutions. Add to that our worldwide network of doers and experts, and you'll see that the opportunities to grow and build are limitless. We work as a team, collaborating with empathy to make really big things happen on a global scale. Because our solutions are everywhere, our impact is everywhere.

We are Cisco, and our power starts with you.